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• MVP 3Q26

  The milestone 3Q 2026 Focuses on completing advanced features of reconfiguration and hardening and productization. Protocol enhancements and robustness - Node rejoin - Better equivocation - Better fault tolerance on corner cases Productization, hardening: - Logger – better logging with name per components and instance - Monitoring - Debug trace on broadcast and deliver requests - Golang pprof Testing: - extensive unit testing - increase coverage - extensive integration testing - coverage of new features (join) - e2e integration testing with committer - chaos testing

  Due by September 30, 2026

  •1/32 issues closed
  3% complete31 open1 closed

• MVP 2Q26

  The milestone 2Q 2026 Focuses on completing advanced features of reconfiguration and hardening and productization. Assembler join with assembler-to-assembler catchup Productization, hardening: - Operations: - change log level on runtime - Health checks - Dev ops – dependencies, build dockerization, automation - Logger – better logging with name per components and instance - Monitoring - Multichannel – channel name only, independent deployments - Debug trace on broadcast and deliver requests - Golang pprof Testing: - extensive unit testing - increase coverage - extensive integration testing - coverage of new features (join) - e2e integration testing with committer - chaos testing

  Overdue by 1 month(s)

  •

  Due by July 1, 2026

  •57/83 issues closed
  68% complete26 open57 closed

• After MVP: EoY 2026

  Epics that do not fit into our plan for EoY 2025, because of lack of resource or priority.

  Due by December 30, 2026

  •3/34 issues closed
  8% complete31 open3 closed